Jacob F Theisen

Title: Jacob F. Theisen: Innovator in Semiconductor Technology

Introduction

Jacob F. Theisen is a notable inventor based in Manassas, VA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods that enhance the manufacturing processes of semiconductor devices.

Latest Patents

Jacob's latest patents include a "Method for Making Borderless Contacts" and a "Planarization Process for Wide Trench Isolation." The first patent discloses a process for creating borderless contacts through an insulating layer to active regions of a semiconductor device. This involves the deposition of a silicon nitride layer and an insulation glass layer on a substrate coating semiconductor devices, followed by the etching of contact windows through the glass layer using BCl₂ or CHF₃/CF₄ etch gases. The windows are then etched through the silicon nitride with CH₃F or O₂/CHF₃ gases. The second patent describes a method of planarizing wide dielectric filled isolation trenches formed in the surface of a semiconductor. A self-aligned mask is created on the thick conformal layer of dielectric in the depressions over the wide trenches to protect the dielectric during the planarization steps.

Career Highlights

Jacob F. Theisen is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Jacob has collaborated with notable coworkers such as Charles P. Breiten and David Stanasolovich. Their combined expertise contributes to the innovative environment at IBM.

Conclusion

Jacob F. Theisen is a prominent figure in the semiconductor industry, recognized for his innovative patents and contributions to technology. His work continues to influence the field and drive advancements in semiconductor manufacturing.