Company Filing History:
Years Active: 1979-1986
Title: Jack S Conrad: Innovator in High Density Interconnect Systems
Introduction
Jack S Conrad is a notable inventor based in Harrisburg, PA, who has made significant contributions to the field of electrical engineering. He holds two patents that showcase his innovative approach to interconnect systems, which are essential in modern electronic devices.
Latest Patents
Conrad's latest patents include a high density interconnect system and a modular plug board system. The high density interconnect system features a laminated board with conductive power and ground planes, designed to facilitate efficient electrical connections. This system includes various contacts that are selectively mounted to ensure proper electrical engagement with signal contacts and pins of a signature board. The modular plug board system allows for the interconnection of an array of parallel cards in a card cage, enabling individual removal and connection of cards to an IO circuit board.
Career Highlights
Jack S Conrad is currently associated with Amp LLC, where he continues to develop innovative solutions in the field of electrical interconnects. His work has been instrumental in advancing the technology used in electronic devices, making them more efficient and reliable.
Collaborations
Conrad has collaborated with notable coworkers such as Richard F Granitz and Joseph L Lockard, contributing to the development of cutting-edge technologies in their field.
Conclusion
Jack S Conrad's contributions to high density interconnect systems and modular plug board systems highlight his role as an influential inventor in electrical engineering. His work continues to impact the industry positively.