Jack L Langdon

Title: Jack L. Langdon: Innovator in Integrated Circuit Packaging

Introduction

Jack L. Langdon is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of integrated circuit packaging. His innovative designs have paved the way for advancements in semiconductor technology.

Latest Patents

Jack L. Langdon holds a patent for a "Package for mounting and interconnecting a plurality of large scale." This invention focuses on a package designed for mounting, interconnecting, and cooling a large number of integrated circuit semiconductor devices. The patent describes a sintered multilayer ceramic substrate with an internal metallurgy network, which includes voltage planes, X and Y signal planes, and fan-out planes. The design features I/O pins on the bottom surface and asymmetrical solder pad clusters for flip chip bonding to integrated circuit devices on the top surface. This innovative approach minimizes voltage drop and enhances signal integrity.

Career Highlights

Jack L. Langdon is associated with International Business Machines Corporation (IBM), where he has contributed to various projects in semiconductor technology. His work has been instrumental in developing efficient packaging solutions for integrated circuits. Langdon's expertise in this area has made him a valuable asset to his team.

Collaborations

Jack has collaborated with Irving Feinberg, a fellow innovator in the field. Their partnership has led to advancements in integrated circuit packaging and has furthered the development of innovative solutions in the industry.

Conclusion

Jack L. Langdon's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His patent and work at IBM highlight his role as a key player in the advancement of semiconductor devices.