San Diego, CA, United States of America

Jack A Rubin


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Jack A Rubin: Innovator in Heat-Dissipating Technologies

Introduction

Jack A Rubin is a notable inventor based in San Diego, CA. He has made significant contributions to the field of materials engineering, particularly in the development of heat-dissipating structures for microelectronic components. His innovative approach has led to advancements in manufacturing processes that enhance the performance and efficiency of electronic devices.

Latest Patents

Jack A Rubin holds a patent for a manufacturing method of heat-dissipating aluminum silicon carbide composite. This process allows for the low-cost production of lightweight structures such as heatsinks and heat spreaders. The method involves selecting mass-produced Al–SiC material, forming it into a thin ribbon, and then stamping or coining the ribbon into the desired structures. This innovative technique utilizes commonly available AlSiC composites, which are manufactured in high volume for various applications.

Career Highlights

Throughout his career, Jack has focused on improving the manufacturing processes of advanced materials. His work has been instrumental in creating efficient solutions for the electronics industry. He is currently associated with Polese Company, Inc., where he continues to develop innovative technologies that address the challenges of heat dissipation in microelectronics.

Collaborations

Jack A Rubin has collaborated with notable professionals in his field, including Frank J Polese and Michael J Singer. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Jack A Rubin's contributions to the field of heat-dissipating technologies exemplify the impact of innovative thinking in engineering. His patented methods and collaborative efforts continue to shape the future of microelectronic components.

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