Kamakura, Japan

Ippei Chimura


Average Co-Inventor Count = 5.7

ph-index = 4

Forward Citations = 53(Granted Patents)


Location History:

  • Kamakura, JP (1979 - 1982)
  • Yokohama, JP (1982)

Company Filing History:


Years Active: 1979-1982

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5 patents (USPTO):Explore Patents

Title: Innovations of Ippei Chimura

Introduction

Ippei Chimura is a notable inventor based in Kamakura, Japan. He has made significant contributions to the field of packaging technology, holding a total of 5 patents. His work focuses on developing advanced materials and processes that enhance the functionality and efficiency of packaging solutions.

Latest Patents

One of his latest patents is for a composite packing film and packing bag made of the same material. This innovative composite packing film consists of a base film with minimal longitudinal and transverse elongations, layered with unidirectionally elongated films and a sealant layer. The design ensures a significant difference in resistance against end tearing, enhancing the durability of the packaging. Another notable patent involves a process for the preparation of paper-backed adhesive tapes. This process includes lap-sealing a widthwise-stretched film on backing paper and applying a pressure-sensitive adhesive, resulting in a high-quality adhesive tape.

Career Highlights

Throughout his career, Ippei Chimura has worked with prominent companies such as Toyo Kagaku and Sanyo Kokusaku Pulp Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the packaging industry.

Collaborations

Ippei has collaborated with talented individuals like Hiroshi Asakura and Keisuke Kitazume. These partnerships have fostered a creative environment that has led to the development of groundbreaking packaging solutions.

Conclusion

Ippei Chimura's contributions to packaging technology through his patents and collaborations highlight his innovative spirit and dedication to advancing the industry. His work continues to influence the field, paving the way for future advancements in packaging materials and processes.

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