Company Filing History:
Years Active: 2015-2018
Title: Ingo Putsch: Innovator in Film Packaging Technology
Introduction
Ingo Putsch is a notable inventor based in Lengerich, Germany. He has made significant contributions to the field of packaging technology, particularly in the development of innovative film products. With a total of 2 patents, Putsch has demonstrated his expertise and creativity in addressing the needs of the packaging industry.
Latest Patents
Putsch's latest patents include a film product designed for packaging products in sealed film packages. This invention relates to a film product that is particularly suitable for packing liquids, pasty, and pourable materials in sealed film packages. The product comprises at least two film layers, where the outwardly facing film layer is thermally stable, and the inwardly facing film layer is sealable. Both film layers are produced using a water-cooled coextrusion blow molding process.
Another significant patent by Putsch is a deviation device for a web of film. This device features at least one deviation element that interacts with the film web at the point of deviation and guides it on an air cushion. The deviation element can be rotated and is equipped with a drive device that sets it into rotation, allowing the peripheral speed of the deviation element to differ from the transport speed of the film web.
Career Highlights
Throughout his career, Ingo Putsch has worked with prominent companies in the packaging industry, including Windmöller & Hölscher KG. His experience in these organizations has allowed him to refine his skills and contribute to advancements in film packaging technology.
Collaborations
Putsch has collaborated with notable professionals in the field, including Gerhard Schoone and Raymond Van Hoorn. These collaborations have further enriched his work and have led to innovative solutions in packaging technology.
Conclusion
Ingo Putsch is a distinguished inventor whose work in film packaging technology has made a significant impact on the industry. His innovative patents and collaborations highlight his commitment to advancing packaging solutions.