Company Filing History:
1 out of 2,652 
1 out of 1 Years Active: 2018
Title: In Oh Hong: Innovator in Hot-Melt Adhesive Technology
Introduction
In Oh Hong is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of adhesive technology, particularly through his innovative methods for preparing hot-melt adhesive compositions. His work is characterized by a focus on enhancing the performance and durability of adhesive products.
Latest Patents
In Oh Hong holds 1 patent for his invention titled "Method for preparing hot-melt adhesive composition and hot-melt adhesive composition prepared thereby." This patent discloses a method that involves preparing and mixing raw materials, including butyl rubber, ethylene propylene diene (EPDM) rubber, a styrene block copolymer, amorphous poly-alpha-olefin (APAO), and a tackifier resin. The process includes vacuum degassing of the mixed raw materials, ensuring that the final hot-melt adhesive composition exhibits high resistance to temperature cycles. This innovation is particularly beneficial for sealing headlamps, as it maintains physical properties throughout the lifespan of the product without generating gas that could lead to bubbles or voids.
Career Highlights
Throughout his career, In Oh Hong has worked with prominent companies in the automotive and adhesive industries. Notably, he has been associated with Hyundai Mobis Co., Ltd. and Okong Corporation. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and contribute to various projects that enhance product performance.
Collaborations
In his professional journey, In Oh Hong has collaborated with talented individuals such as Seong Ho Kim and Jung Hwan Lee. These collaborations have fostered a creative environment that has led to innovative solutions in adhesive technology.
Conclusion
In Oh Hong's contributions to the field of hot-melt adhesives demonstrate his commitment to innovation and excellence. His patented methods not only improve product performance but also address critical issues in adhesive applications. His work continues to influence the industry and pave the way for future advancements.