In Goo Kang

Title: In Goo Kang: Innovator in Wafer Level Package Fabrication

Introduction

In Goo Kang is a distinguished inventor located in Gyunggi-do, South Korea. He holds a significant patent in the field of semiconductor packaging, specifically focusing on wafer level package fabrication.

Latest Patents

In Goo Kang's notable patent is a wafer level package fabrication method. This method involves providing a device substrate wafer that includes one or more devices on its upper surface, along with a bonding pad that is electrically connected to these devices. The innovation encompasses a bonding seal surrounding the device along the bonding pad, which facilitates a bond between a cap substrate wafer and the device substrate wafer. This cap substrate has a via that aligns with the bonding pad. The process also includes forming an external terminal on the cap substrate wafer that connects to the bonding pad. The final step involves cutting both the cap substrate and the device substrate along a defined cutting line, effectively creating multiple wafer level packages. This method is praised for its ability to reduce product size for miniaturization and perform the bonding process without causing wafer deformation or damage, thus increasing the range of wafer material options.

Career Highlights

In Goo Kang is currently employed by Samsung Electro-Mechanics Co., Ltd., a leading company in the field of electronic components and devices. His work is pivotal to the ongoing advancements in semiconductor technology, particularly in compact and efficient packaging solutions.

Collaborations

Throughout his career, In Goo Kang has had the opportunity to collaborate with prominent colleagues such as Jingli Yuan and Jae Cheon Doh. Together, they contribute to innovative projects that push the boundaries of technology and improve manufacturing processes.

Conclusion

In Goo Kang’s contributions to the field of wafer level package fabrication exemplify the spirit of innovation in the semiconductor industry. His patent showcases a remarkable approach to enhancing product miniaturization and efficiency, making significant strides in modern electronics manufacturing.