Danielson, CT, United States of America

Ian Smith


Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Danielson, CT (US) (2005 - 2017)
  • Dayville, CT (US) (2022)

Company Filing History:


Years Active: 2005-2022

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3 patents (USPTO):Explore Patents

Title: Ian Smith: Innovator in Thermal Management Solutions

Introduction

Ian Smith is a notable inventor based in Danielson, CT (US). He has made significant contributions to the field of thermal management through his innovative patents. With a total of 3 patents, Smith has developed technologies that enhance the efficiency of thermal systems.

Latest Patents

One of Ian Smith's latest patents is for fusible phase-change powders for thermal management, which includes a composition of powder particles made from a polymer composition and an unencapsulated phase-change material. This powder composition is designed to be fusible at various temperature ranges, including 25 to 105°C, 28 to 60°C, 45 to 85°C, 60 to 80°C, and 80 to 100°C. Another significant patent is for compressible thermally conductive articles, which feature a thermally conductive sheet with a plurality of through holes in a foam material. This design connects first and second heat transfer surfaces, providing efficient thermal pathways between them.

Career Highlights

Throughout his career, Ian Smith has worked with reputable companies such as Rogers Corporation and U.S. Cosmetics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in thermal management technologies.

Collaborations

Ian has collaborated with talented individuals in his field, including Sharon Soong and Masaru Kobayashi. These partnerships have fostered innovation and the development of cutting-edge solutions in thermal management.

Conclusion

Ian Smith's work in thermal management exemplifies the impact of innovative thinking in technology. His patents reflect a commitment to improving thermal efficiency and performance in various applications.

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