Hyunglak Ma

Title: Hyunglak Ma: Innovator in Semiconductor Packaging

Introduction

Hyunglak Ma is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the design and development of semiconductor package devices. His innovative work has led to the filing of a patent that showcases his expertise and creativity in this specialized area.

Latest Patents

Hyunglak Ma holds a patent for a semiconductor package device. This device includes a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. Notably, at least a portion of a top surface of the molding member is spaced apart from a bottom surface of the second package substrate. This innovative design aims to enhance the performance and reliability of semiconductor packages.

Career Highlights

Hyunglak Ma is currently employed at Samsung Electronics Co., Ltd., a leading global technology company known for its advancements in electronics and semiconductor manufacturing. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the company's reputation for innovation in the tech industry.

Collaborations

Throughout his career, Hyunglak Ma has collaborated with talented professionals in the field. Some of his notable coworkers include Jangwoo Lee and Jongbo Shim, who have also contributed to advancements in semiconductor technology.

Conclusion

Hyunglak Ma's contributions to semiconductor packaging exemplify the spirit of innovation in technology. His patent and work at Samsung Electronics Co., Ltd. highlight his role as a key player in the advancement of semiconductor devices. His ongoing efforts continue to shape the future of this critical industry.