Company Filing History:
Years Active: 2021
Title: Innovations by Hyung Seop Shin
Introduction
Hyung Seop Shin is a notable inventor based in Andong-si, South Korea. He has made significant contributions to the field of material science, particularly in evaluating material embrittlement behavior under various gaseous hydrogen environments. His work is essential for understanding how materials behave in challenging conditions.
Latest Patents
Hyung Seop Shin holds a patent for a "Small-punch test apparatus for quantitatively evaluating material embrittlement behavior under various gaseous hydrogen environments." This innovative technology allows for the quantitative assessment of material embrittlement behavior by utilizing a small-punch test device. The device is designed to fix a specimen within a jig that comprises upper and lower dies, with gas filled at the lower part of the specimen. A punch applies force to bend the specimen in a vertical downward direction while measuring the effects of the influent gas. The apparatus also includes an insulating container and a temperature measuring device to monitor the internal temperature and the specimen's temperature. Additionally, a heat transfer device is incorporated to transfer heat to the specimen.
Career Highlights
Hyung Seop Shin is affiliated with the Andong National University Industry-Academic Cooperation Foundation. His role at this institution allows him to engage in research and development activities that bridge the gap between academia and industry. His work is instrumental in advancing the understanding of material properties in various environments.
Collaborations
One of his notable collaborators is Kyung Oh Bae. Their partnership has contributed to the development of innovative solutions in material science.
Conclusion
Hyung Seop Shin's contributions to material science through his patented technology highlight the importance of innovation in evaluating material behavior under extreme conditions. His work continues to influence the field and pave the way for future advancements.