Hyung S Kim

Title: Hyung S Kim: Innovator in High-Speed Memory Packaging

Introduction

Hyung S Kim is a notable inventor based in Temecula, CA (US). He has made significant contributions to the field of computer systems through his innovative patent. His work focuses on enhancing memory packaging schemes to improve the performance of high-speed computer systems.

Latest Patents

Hyung S Kim holds a patent for a "High speed memory packaging scheme." This invention involves a memory packaging scheme designed for high-speed computer systems. It includes several memory module sockets mounted to a printed circuit board, interconnected by a common set of address, data, and control transmission lines. The design allows for the installation of memory modules, such as SIMM memory modules, in sequence according to the computer system's requirements. This innovative approach effectively eliminates undesirable transmission line effects within the printed circuit board.

Career Highlights

Hyung S Kim is currently associated with NCR Corporation, where he applies his expertise in memory systems. His work has contributed to advancements in computer technology, particularly in memory management and efficiency.

Collaborations

Throughout his career, Hyung S Kim has collaborated with talented individuals such as Ikuo J Sanwo and Michael A Hoffman. These collaborations have further enriched his contributions to the field of technology.

Conclusion

Hyung S Kim's innovative work in high-speed memory packaging has made a significant impact on computer systems. His patent reflects a deep understanding of memory management, showcasing his role as a key inventor in this domain.