Hyun Hang Park

Title: Hyun Hang Park: Innovator in Integrated Circuit Package Substrates

Introduction

Hyun Hang Park is a notable inventor based in Asan-si, South Korea. He has made significant contributions to the field of integrated circuit technology, particularly through his innovative designs and patents.

Latest Patents

Hyun Hang Park holds a patent for an integrated circuit package substrate. This invention focuses on enhancing the conductivity and reliability of integrated circuit package substrates. The design improves the adhesive force between the metal lines that connect the upper and lower parts of the substrate and the glass formed within it. The integrated circuit package substrate consists of a core made of glass, with metal thin plates made of copper (Cu) on both the upper and lower parts. A metal line, also made of Cu, penetrates through these layers to ensure electrical connectivity. An intermediate layer, which may include CuO or other metal oxides, is formed on the outer surface of the metal line.

Career Highlights

Hyun Hang Park is currently employed at Corning Precision Materials Co., Ltd. His work at this company has allowed him to focus on developing advanced materials and technologies for integrated circuits. His innovative approach has led to the successful patenting of his designs, showcasing his expertise in the field.

Collaborations

Hyun Hang Park has collaborated with several talented individuals, including Bo Gyeong Kim and Hyun Bin Kim. These collaborations have contributed to the advancement of technology in integrated circuit packaging.

Conclusion

Hyun Hang Park is a distinguished inventor whose work in integrated circuit package substrates has made a significant impact in the field. His innovative designs and patents reflect his commitment to advancing technology and improving the reliability of electronic components.