Company Filing History:
Years Active: 2025
Title: Hyo-chang Ryu: Innovator in Semiconductor Packaging
Introduction
Hyo-chang Ryu is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative patents.
Latest Patents
Hyo-chang Ryu holds a patent for a "Method of fabricating semiconductor package including sub-interposer substrates." This semiconductor package includes a package substrate, a first interposer substrate mounted on the package substrate, and a first semiconductor chip disposed on the first interposer substrate. The first interposer substrate consists of a first base layer, a second base layer, circuit patterns in both layers, and an integrated device embedded in the first base layer, connected to at least one of the circuit patterns. The design ensures that the top surface of the first base layer contacts the bottom surface of the second base layer. He has 1 patent to his name.
Career Highlights
Hyo-chang Ryu is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and functionality of semiconductor packages.
Collaborations
He has collaborated with notable colleagues, including Yanggyoo Jung and Chulwoo Kim, contributing to various projects that enhance semiconductor packaging technologies.
Conclusion
Hyo-chang Ryu's innovative work in semiconductor packaging exemplifies his commitment to advancing technology in this critical field. His contributions are paving the way for future developments in semiconductor applications.