Suwon-si, South Korea

Hyeon Seok Lee

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2019-2020

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2 patents (USPTO):Explore Patents

Title: Hyeon Seok Lee: Innovator in Semiconductor Technology

Introduction

Hyeon Seok Lee is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative packaging solutions that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of Hyeon Seok Lee's latest patents is a fan-out semiconductor package. This invention includes a core member with a through-hole, where a semiconductor chip is positioned. The chip features an active surface with connection pads and an inactive surface opposing it. An encapsulant surrounds portions of both the core member and the semiconductor chip, filling part of the through-hole. Additionally, a connection member is placed on the core member and the active surface of the semiconductor chip, which includes a redistribution layer that is electrically connected to the connection pads. The core member also has a groove portion that penetrates from the wall of the through-hole to the outer side surface of the core member, located in the lower portion where the connection member is situated.

Career Highlights

Hyeon Seok Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves developing advanced semiconductor packaging technologies that are crucial for modern electronic devices. His innovative approaches have contributed to the company's reputation for excellence in technology.

Collaborations

Throughout his career, Hyeon Seok Lee has collaborated with talented coworkers, including Seung Soo Ha and Sun Ho Kim. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies in the semiconductor field.

Conclusion

Hyeon Seok Lee is a notable inventor whose work in semiconductor packaging has made a significant impact on the industry. His innovative patents and contributions to Samsung Electronics Co., Ltd. highlight his expertise and dedication to advancing technology.

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