Company Filing History:
Years Active: 2015-2023
Title: Hwee Lun Goh: Innovator in Flexible Packaging Technologies
Introduction
Hwee Lun Goh is a notable inventor based in Singapore, recognized for his contributions to the field of flexible packaging technologies. With a total of two patents to his name, Goh has made significant advancements in the development of multilayer films that enhance packaging efficiency and sustainability.
Latest Patents
Goh's latest patents include innovative methods for creating flexible packaging film laminates. One of his patents focuses on multilayer film embodiments produced via thermal lamination without the use of adhesives. This is achieved through the incorporation of tie layers made from a blend of ethylene acrylate copolymer and an anhydride grafted ethylene alpha-olefin copolymer. Another patent details a multilayer film that consists of at least two layers, where the first layer includes a specific interpolymer of ethylene and alpha-olefin, characterized by a density of less than 0.925 g/cm3. This film technology aims to improve the performance and environmental impact of packaging materials.
Career Highlights
Hwee Lun Goh is currently employed at Dow Global Technologies LLC, where he continues to innovate in the field of materials science. His work focuses on developing advanced packaging solutions that meet the evolving needs of the industry.
Collaborations
Goh collaborates with talented colleagues, including Xiao Bing Yun and Risdianti Wastiani, to drive forward the research and development of new packaging technologies.
Conclusion
Hwee Lun Goh's contributions to flexible packaging technologies exemplify the importance of innovation in addressing modern packaging challenges. His patents reflect a commitment to enhancing material performance while promoting sustainability in the industry.