Hwa Sub Oh

Title: Hwa Sub Oh: Innovator in Semiconductor Technology

Introduction

Hwa Sub Oh is a prominent inventor based in Suwon-si, South Korea. He is known for his contributions to semiconductor technology, particularly in the development of innovative packaging solutions. His work has significantly impacted the efficiency and performance of electronic devices.

Latest Patents

Hwa Sub Oh holds a patent for a fan-out semiconductor package. This advanced package includes a semiconductor chip with an active surface featuring connection pads and an inactive surface. A heat dissipation member is attached to the inactive surface, while an encapsulant covers portions of both the semiconductor chip and the heat dissipation member. Additionally, a connection member on the active surface includes a redistribution layer that is electrically connected to the connection pads. Notably, the heat dissipation member has a thickness greater than that of the semiconductor chip. This innovation enhances thermal management in semiconductor applications.

Career Highlights

Hwa Sub Oh is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role involves research and development in semiconductor packaging, where he applies his expertise to create cutting-edge solutions that meet the demands of modern electronics.

Collaborations

Hwa Sub Oh collaborates with various professionals in the field, including his coworker Doo Hwan Lee. Together, they work on advancing semiconductor technologies and improving product performance.

Conclusion

Hwa Sub Oh's contributions to semiconductor packaging exemplify the innovative spirit of modern technology. His patent for the fan-out semiconductor package showcases his commitment to enhancing electronic device efficiency. His work at Samsung Electronics Co., Ltd. continues to influence the future of semiconductor technology.