Hsinhua, Taiwan

Hung-Yi Wang


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Innovations of Hung-Yi Wang in Film Printed Circuit Board Manufacturing

Introduction

Hung-Yi Wang is a notable inventor based in Hsinhua, Taiwan. He has made significant contributions to the field of electronics, particularly in the manufacturing of film printed circuit boards. His innovative methods have paved the way for advancements in this technology.

Latest Patents

Hung-Yi Wang holds a patent for a "Method of manufacturing a film printed circuit board." This patent describes a process that involves using a film substrate made of polyimide, an alloy layer, and a first copper layer. The method includes performing a lithographic and etching process to create conductive line structures on the substrate. A second copper layer is then added, followed by another lithographic and etching process to finalize the design.

Career Highlights

Wang is currently employed at Himax Technologies, Inc., where he continues to work on innovative solutions in the electronics sector. His expertise in manufacturing processes has been instrumental in the development of advanced circuit board technologies.

Collaborations

Some of his coworkers include Chia-Hui Wu and Pai-Sheng Cheng, who collaborate with him on various projects within the company.

Conclusion

Hung-Yi Wang's contributions to the field of film printed circuit board manufacturing highlight his innovative spirit and dedication to advancing technology. His work continues to influence the electronics industry positively.

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