This inventor holds 1 USPTO granted patent. Top assignee: Himax Technologies, Inc.. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Innovations of Hung-Yi Wang in Film Printed Circuit Board Manufacturing
Introduction
Hung-Yi Wang is a notable inventor based in Hsinhua, Taiwan. He has made significant contributions to the field of electronics, particularly in the manufacturing of film printed circuit boards. His innovative methods have paved the way for advancements in this technology.
Latest Patents
Hung-Yi Wang holds a patent for a "Method of manufacturing a film printed circuit board." This patent describes a process that involves using a film substrate made of polyimide, an alloy layer, and a first copper layer. The method includes performing a lithographic and etching process to create conductive line structures on the substrate. A second copper layer is then added, followed by another lithographic and etching process to finalize the design.
Career Highlights
Wang is currently employed at Himax Technologies, Inc., where he continues to work on innovative solutions in the electronics sector. His expertise in manufacturing processes has been instrumental in the development of advanced circuit board technologies.
Collaborations
Some of his coworkers include Chia-Hui Wu and Pai-Sheng Cheng, who collaborate with him on various projects within the company.
Conclusion
Hung-Yi Wang's contributions to the field of film printed circuit board manufacturing highlight his innovative spirit and dedication to advancing technology. His work continues to influence the electronics industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile