Hung Ya Chao

Title: Inventor Spotlight: Hung Ya Chao

Introduction

Hung Ya Chao is an innovative inventor based in Dayton, NJ, known for his significant contributions to the field of adhesive technology. With a total of three patents to his name, Chao has made strides in the development of microencapsulated adhesives that possess unique properties and applications.

Latest Patents

Chao's latest patents revolve around the creation of microencapsulated adhesives. One of his notable inventions details a microencapsulated adhesive produced from an alkyl acrylate or methacrylate monomer with carbon chains ranging from four to twelve. This innovative adhesive is characterized by its ability to remain non-tacky until external forces, like shearing, are applied. The microencapsulation methods he employs include interfacial polymerization and melamine/formaldehyde encapsulation, resulting in versatile applications such as adhesives for stamps and envelopes.

Additionally, he has produced a solvent-based adhesive composition that is also microencapsulated, further demonstrating his commitment to enhancing adhesive technologies. By removing the solvent from the microcapsules through heating or reduced pressure, Chao's adhesive remains non-tacky until required, showcasing his inventive approach to practical challenges within adhesive applications.

Career Highlights

Hung Ya Chao is associated with Moore Business Forms, Inc., where he has been able to apply his inventive talents in the development of industry-relevant technologies. His focus on microencapsulated adhesives highlights his ability to blend creativity with functionality in the formulation of adhesives used across various applications.

Collaborations

While specific collaborative projects have not been detailed, Chao's work at Moore Business Forms, Inc. suggests potential partnership and teamwork with professionals in the fields of materials science and engineering. By working alongside experts, he likely strives to push the boundaries of adhesive technologies.

Conclusion

Hung Ya Chao exemplifies the essence of innovation in adhesive technology through his inventions of microencapsulated adhesives. As an inventor with a focus on practical and adaptable solutions, his patents pave the way for future advancements in the application of adhesives, reinforcing the importance of inventors in driving technological progress.