Company Filing History:
Years Active: 2009
Title: The Innovative Contributions of Hung-Wen Shih
Introduction
Hung-Wen Shih is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative chip structures that enhance performance and efficiency.
Latest Patents
Hung-Wen Shih holds a patent for a "Chip structure with bevel pad row." This invention comprises a substrate, multiple middle pad rows, and a bevel pad row. The substrate features an active surface that includes both a middle wire bonding area and a corner wire bonding area. The design allows for improved wire bonding capabilities, with the bevel pad row containing a greater number of bevel pads than the middle pad rows.
Career Highlights
Hung-Wen Shih is currently employed at Via Technologies, Inc., where he continues to push the boundaries of innovation in chip design. His work has been instrumental in advancing the technology used in various electronic devices.
Collaborations
He has collaborated with talented coworkers such as Yuan-Tsang Liaw and Chi-Hsing Hsu, contributing to a dynamic and innovative work environment.
Conclusion
Hung-Wen Shih's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work at Via Technologies, Inc. continues to influence the industry positively.