Company Filing History:
Years Active: 2007
Title: Innovations of Inventor Hung-Wei Tseng
Introduction: Hung-Wei Tseng is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of antenna technology. His innovative designs have led to the development of a unique antenna structure that enhances performance and reduces interference.
Latest Patents: Hung-Wei Tseng holds 1 patent for an antenna structure. This patent describes an antenna module that includes a printed circuit board (PCB) with multiple contacts, a support element, and the antenna module itself. The design features a support portion that extends downward, allowing for a stable connection between the antenna module and the PCB. Notably, when the antenna module is connected, the antenna contact does not protrude from the bottom of the PCB, ensuring a level surface. Additionally, the metal support element serves to shield against noise interference, improving the overall functionality of the antenna.
Career Highlights: Hung-Wei Tseng is currently employed at Inpaq Technology Co., Ltd. His work at this company has allowed him to focus on advancing antenna technologies. His innovative approach has positioned him as a key player in the field.
Collaborations: Hung-Wei Tseng collaborates with his coworker, Yueh-Lin Tsai, to further enhance their research and development efforts in antenna technology.
Conclusion: Hung-Wei Tseng's contributions to antenna technology through his innovative designs and patents demonstrate his expertise and commitment to advancing the field. His work continues to influence the development of efficient and effective antenna systems.