Hung Wei Tseng

Title: Innovations by Inventor Hung Wei Tseng

Introduction

Hung Wei Tseng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of thermal management through his innovative designs of heat sinks. With a total of 3 patents to his name, Tseng's work focuses on enhancing heat dissipation efficiency in various applications.

Latest Patents

One of his latest patents involves a heat sink that boasts excellent heat dissipation efficiency. This design features a heat receiving plate that is thermally connected to a heating element, along with heat pipes formed from a tube body. The heat pipes are arranged in multiple layers vertically, ensuring that their positions on the surface of the heat receiving plate are not identical, which optimizes thermal diffusion characteristics.

Another patent describes a heat sink that suppresses the formation of a boundary layer on the surfaces of heat radiating fins. This design allows portions of the fins, other than the windward side, to exhibit excellent heat radiation properties. The heat sink includes a base plate and two adjacent heat radiating fins, with one fin positioned lower than the other in a vertical direction, enhancing overall thermal performance.

Career Highlights

Hung Wei Tseng is currently employed at The Furukawa Electric Co., Ltd., where he continues to innovate in the field of thermal management. His work has been instrumental in developing advanced heat sink technologies that are crucial for various electronic applications.

Collaborations

Tseng collaborates with talented individuals such as Masahiro Meguro and Kuang Yu Chu, contributing to a dynamic team focused on pushing the boundaries of thermal technology.

Conclusion

Hung Wei Tseng's innovative contributions to heat sink technology demonstrate his commitment to improving thermal management solutions. His patents reflect a deep understanding of thermal dynamics and a dedication to enhancing efficiency in electronic devices.