Hung-Ming Weng

Title: Innovations by Inventor Hung-Ming Weng in Image Sensor Technology

Introduction: Hung-Ming Weng is a notable inventor based in San Jose, CA, who has made significant contributions to the field of image sensor technology. With a total of two patents to his name, Weng continues to push the boundaries of innovation, particularly in enhancing the performance and functionality of image sensors.

Latest Patents: Among his latest patents, Weng has developed notable inventions including the "Contact Resistance Reduction" patent. This innovative image sensor features a plurality of photodiodes within a semiconductor material, enhancing the efficiency of image charge transfer through a carefully designed electrical contact system. The second patent, "Integrated Circuit Stack with Strengthened Wafer Bonding," presents an integrated circuit system that improves wafer bonding by utilizing dielectric materials with a higher silicon concentration. This enhances conductivity between the first and second device wafers, showcasing Weng's expertise in semiconductor technology.

Career Highlights: Hung-Ming Weng is currently employed at OmniVision Technologies, Inc., where he applies his innovative thinking to various projects related to image sensors. His work involves designing advanced technologies that cater to the growing needs of the visual processing market.

Collaborations: Weng collaborates with esteemed colleagues such as Hsin-Neng Tai and Kevin Ka Kei Leung, among others. This collaboration fosters an environment of shared knowledge and expertise, which is fundamental in driving the innovation process forward.

Conclusion: Hung-Ming Weng's contributions to image sensor technology are exemplary of the innovative spirit that fosters advancement in the field. With his patents and ongoing work at OmniVision Technologies, he plays a crucial role in developing cutting-edge solutions that enhance imaging capabilities, highlighting the importance of collaboration in driving technological progress.