Company Filing History:
Years Active: 2002-2006
Title: Innovations of Inventor Hung Manh Dang
Introduction
Hung Manh Dang is a notable inventor based in Brossard, Canada. He has made significant contributions to the field of electronics, particularly in the area of electronic structures. With a total of 3 patents to his name, his work focuses on improving adhesion in electronic assemblies.
Latest Patents
One of Hung Manh Dang's latest patents is titled "Cap attach surface modification for improved adhesion." This invention involves an electronic structure that can be bonded to an electronic assembly, such as a chip, using a structural epoxy adhesive. The electronic structure features a mineral layer on a metallic plate, along with an adhesion promoter layer on the mineral layer. The metallic plate is made from a metallic substance that may include pure metals, such as stainless steel, aluminum, titanium, copper, and various coatings. The mineral layer consists of chemical compounds derived from minerals, such as silicon dioxide, silicon nitride, and silicon carbide, which can exist in either crystalline or amorphous forms. The adhesion promoter may include chemical substances like silanes, titanates, zirconates, and aluminates.
Career Highlights
Hung Manh Dang is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore innovative solutions in the electronics industry, contributing to advancements in technology.
Collaborations
Throughout his career, Hung Manh Dang has collaborated with notable colleagues, including Stephen L Buchwalter and Michael A Gaynes. These collaborations have further enriched his work and contributed to the development of his patents.
Conclusion
Hung Manh Dang's contributions to the field of electronics through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.