Company Filing History:
2 out of 396 
1 out of 2,062 
Years Active: 2021
Title: Innovations by Inventor Hung Chau
Introduction
Hung Chau is a notable inventor based in Fountain Valley, CA (US). He has made significant contributions to the field of electronic device packaging through his innovative patents. With a total of 2 patents, Chau's work focuses on enhancing the performance and longevity of underfill films used in advanced electronic applications.
Latest Patents
Chau's latest patents include "Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages." This invention provides stabilized underfill film-containing assemblies that extend the work-life and shelf-life of underfill films. Additionally, he has developed "Thermally conductive pre-applied underfill formulations and uses thereof." This patent describes thermally conductive underfill compositions that are useful for various electronic devices, including flip chip packages and stacked dies. The methods outlined in these patents aim to improve heat dissipation and adhesion in electronic assemblies.
Career Highlights
Throughout his career, Hung Chau has worked with prominent companies such as Henkel IP Holding GmbH and Henkel AG & Company, KGaA. His experience in these organizations has allowed him to refine his expertise in materials science and electronic packaging.
Collaborations
Chau has collaborated with talented individuals in his field, including Jie Bai and Ly Do. These partnerships have contributed to the advancement of his innovative projects and patents.
Conclusion
Hung Chau's contributions to the field of electronic device packaging through his patents demonstrate his commitment to innovation and excellence. His work continues to influence the development of advanced materials in the electronics industry.