Huipeng Wu

Title: Innovations by Huipeng Wu in Heat Dissipation Technology

Introduction

Huipeng Wu is a notable inventor based in Shenzhen, China, recognized for his contributions to heat dissipation technology. He holds three patents that showcase his innovative approach to enhancing electronic devices' performance and efficiency.

Latest Patents

One of Huipeng Wu's latest patents is a heat dissipation system and electronic device. This system includes a first heat dissipation panel, a second heat dissipation panel, a first rotating shaft assembly, a second rotating shaft assembly, and a driving apparatus. The design allows for effective communication between the liquid channels of the heat dissipation panels, facilitating the flow of a liquid medium to improve heat management.

Another significant patent is for a film-like heat dissipation member, a bendable display apparatus, and a terminal device. This invention features a heat dissipation layer designed to maintain uniform temperatures on both sides of the bendable display apparatus. The innovative structure allows for repeated bending while enhancing the heat dissipation capabilities of the device.

Career Highlights

Huipeng Wu is currently employed at Huawei Technologies Co., Limited, where he continues to develop cutting-edge technologies. His work focuses on improving the thermal management of electronic devices, which is crucial for their performance and longevity.

Collaborations

He collaborates with talented coworkers, including Quanming Li and Guo Yang, who contribute to the innovative projects at Huawei.

Conclusion

Huipeng Wu's inventions in heat dissipation technology reflect his commitment to advancing electronic device efficiency. His patents not only demonstrate his technical expertise but also contribute significantly to the field of electronics.