Jinan, China

Hui Wei

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Shandong Yingxin Computer Technologies Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hui Wei. Retrieved from https://idiyas.com/inventor/hui-wei-kfo2uc7a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Hui Wei - Innovator in Three-Dimensional Reconstruction Technology

Introduction

Hui Wei is a prominent inventor based in Jinan, China. He has made significant contributions to the field of three-dimensional reconstruction technology. His innovative approach has led to the development of a patented method that enhances the efficiency and quality of three-dimensional modeling.

Latest Patents

Hui Wei holds a patent for a "Three-dimensional reconstruction method, system, and storage medium." This invention involves a comprehensive method that includes local pose optimization, neural network prediction, and global pose optimization. The process aims to achieve high-quality and high-precision three-dimensional reconstruction more quickly and conveniently. The patent showcases his expertise in utilizing advanced technologies to improve reconstruction methods.

Career Highlights

Hui Wei is associated with Shandong Yingxin Computer Technologies Co., Ltd., where he applies his skills in computer technologies and innovations. His work focuses on developing systems that leverage artificial intelligence and machine learning for enhanced performance in three-dimensional reconstruction.

Collaborations

Hui Wei collaborates with talented individuals such as Ruyang Li and Yaqian Zhao, who contribute to his projects and research endeavors. Their teamwork fosters an environment of innovation and creativity, leading to advancements in their respective fields.

Conclusion

Hui Wei's contributions to three-dimensional reconstruction technology exemplify the impact of innovative thinking in the tech industry. His patented methods and collaborative efforts continue to push the boundaries of what is possible in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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