Hui-Fen Wu

Title: Innovations of Hui-Fen Wu in Microelectromechanical Systems

Introduction

Hui-Fen Wu is a notable inventor based in Kao-Hsiung Hsien, Taiwan. She has made significant contributions to the field of microelectromechanical systems (MEMS). Her innovative work focuses on the fabrication of glass diaphragms on silicon macrostructures, which has important applications in various technological domains.

Latest Patents

Hui-Fen Wu holds a patent for a method of fabricating a glass diaphragm on a silicon macrostructure. This method involves several steps, including obtaining a silicon wafer and forming a cavity within it. The process utilizes flame hydrolysis deposition to deposit glass soot into the cavity, which fills the space and extends onto the silicon wafer's surface. The glass soot layer is then heat-consolidated at temperatures ranging from 850°C to 1,350°C, resulting in a glass diaphragm that covers the cavity. The shrinkage ratio between the glass diaphragm and the glass soot layer is between 1:20 to 1:50, showcasing the precision of her method.

Career Highlights

Hui-Fen Wu is affiliated with the Industrial Technology Research Institute, where she continues to advance her research in MEMS. Her work has garnered attention for its innovative approach to integrating glass components with silicon structures, which enhances the functionality and reliability of MEMS devices.

Collaborations

Hui-Fen Wu has collaborated with esteemed colleagues, including Dong-Sing Wuu and Tzung-Rue Hsieh. These collaborations have contributed to the development of advanced technologies in the field of microelectromechanical systems.

Conclusion

Hui-Fen Wu's contributions to the field of microelectromechanical systems through her innovative patent demonstrate her expertise and commitment to advancing technology. Her work continues to influence the development of MEMS, paving the way for future innovations.