Company Filing History:
Years Active: 2003-2012
Title: Hsuan-Cheng Wang: Innovator in Heat Pipe Technology
Introduction
Hsuan-Cheng Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of thermal management through his innovative designs and patents. With a total of 3 patents, Wang has established himself as a key figure in the development of heat pipe technology.
Latest Patents
Wang's latest patents include a heat pipe structure and a flattened heat pipe structure. The heat pipe structure features a pipe body with two closed ends, an inner surface, a compressed portion, and an expanded portion. This design allows for efficient thermal transfer, as the working substance contained in the cavity enhances heat conduction. His second patent, the cooler module and its fastening structure, is designed for mounting on a CPU within a computer. This module includes a mounting base frame made of thermal conductive material, ensuring optimal heat transfer from the CPU.
Career Highlights
Hsuan-Cheng Wang is currently employed at Compal Electronics, Inc., where he continues to innovate in the field of electronics and thermal management. His work has been instrumental in improving the efficiency of cooling systems in various electronic devices.
Collaborations
Wang collaborates with talented individuals such as Wei-Chung Hsiao and Yi-Chen Chung, who contribute to the innovative environment at Compal Electronics.
Conclusion
Hsuan-Cheng Wang's contributions to heat pipe technology and his innovative patents highlight his role as a leading inventor in the field. His work continues to influence the design and efficiency of thermal management systems in electronics.