Hsiu-Feng Yeh

Title: Hsiu-Feng Yeh: Innovator in Microneedle Technology

Introduction

Hsiu-Feng Yeh is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microneedle technology, holding 2 patents that showcase his innovative approach to medical applications.

Latest Patents

His latest patents include a "Multi-layered microneedle patch and method of manufacturing the same." This invention features a microneedle patch that consists of a substrate part and multiple needle parts protruding from it. The substrate part includes a diffusion-proof layer and a base, while each needle part is composed of a needle tip, a diffusion-proof layer, and a base. The design ensures that the diffusion-proof layer prevents active ingredients from diffusing to the base, thereby controlling the quantity of active ingredients at the needle tip. Another significant patent is the "Base composition for microneedle patch and microneedle patch comprising the same." This invention relates to a base composition that enhances the production and usability of microneedle patches, ensuring smooth demolding, desired softness, flexibility, and humidity resistance.

Career Highlights

Hsiu-Feng Yeh has worked with several companies, including Win Coat Corporation and WCC Biomedical Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative medical technologies.

Collaborations

He has collaborated with notable coworkers such as Ta-Jo Liu and Wan-Hua Li, who have also contributed to advancements in the field.

Conclusion

Hsiu-Feng Yeh's work in microneedle technology exemplifies the impact of innovation in medical applications. His patents reflect a commitment to improving healthcare solutions through advanced technology.