Hsien-Ming Wu

Title: Hsien-Ming Wu: Innovator in Micro Electromechanical Device Packaging

Introduction

Hsien-Ming Wu is a distinguished inventor based in Taoyuan Hsien, Taiwan. With a notable patent to his name, Wu has made significant contributions to the field of micro electromechanical devices. His innovative work focuses on improving the reliability and efficiency of these complex devices through advanced packaging techniques.

Latest Patents

Wu's most recent patent, titled "Wafer Level Packaging of Micro Electromechanical Device," addresses the critical need for protecting micro electromechanical devices during their packaging procedure. The invention involves a wafer level package that integrates a wafer composed of multiple micro electromechanical devices alongside a companion package wafer of equal size. Conductor plugs penetrate both the upper and lower surfaces of the package wafer, with solder bumps strategically placed to ensure secure adherence to specific points on the micro electromechanical device wafer. This innovative design not only enhances device security but also mitigates potential damage that could occur during packaging.

Career Highlights

Currently, Hsien-Ming Wu is employed at Lightuning Tech Inc., where he contributes his expertise in micro electromechanical systems. His role within the company allows him to further develop cutting-edge technologies and collaborate with fellow innovators. Wu's dedication to advancing device packaging methods showcases his commitment to improving the functionality and lifespan of micro electromechanical devices.

Collaborations

Throughout his career, Wu has worked alongside talented colleagues such as Bruce C. S. Chou and Ping-Chin Sun. These collaborations have enabled him to exchange ideas and combine efforts toward groundbreaking advancements in packaging technology, fostering an environment of innovation within Lightuning Tech Inc.

Conclusion

Hsien-Ming Wu's contributions to the field of micro electromechanical devices through his patent on wafer level packaging highlight his innovative spirit and problem-solving abilities. As technology continues to evolve, Wu's work at Lightuning Tech Inc. will undoubtedly pave the way for future advancements in device reliability and efficiency, reinforcing his position as a key figure in the realm of micro electromechanical systems innovation.