Taipei, Taiwan

Hsi-Feng Lin


Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 34(Granted Patents)


Company Filing History:


Years Active: 2008-2015

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3 patents (USPTO):Explore Patents

Title: Innovations of Hsi-Feng Lin: Patents and Collaborations in Heat Dissipation Technology

Introduction: Hsi-Feng Lin is a distinguished inventor based in Taipei, Taiwan, renowned for his advancements in thermal management technology. With a total of three patents to his name, his dedication to innovative design has significantly contributed to the field of electronics and heat dissipation solutions.

Latest Patents: Among Hsi-Feng Lin's latest patents is a remarkable invention related to a heat-dissipation module. This module efficiently manages heat generated by circuit board elements and encompasses several key components, including a heat-transferring base, first and second heat-dissipation units, and heat pipes. The innovative design allows for optimal thermal management by ensuring that one surface of the heat-transferring base effectively contacts the heat-generating element. The inclusion of mobile heat-dissipation units offers enhanced flexibility in the design and application of the technology.

Career Highlights: Hsi-Feng Lin's contributions are primarily associated with Asustek Computer Inc., where he applies his expertise in electronic engineering and innovation. His career has been marked by a commitment to pushing the boundaries of technology, particularly in developing solutions tailored for high-performance computing environments.

Collaborations: Throughout his career, Hsi-Feng Lin has collaborated with esteemed colleagues, including Hung-Chun Chu and Yung-Ching Huang. These partnerships enhance the innovative process, allowing for the exchange of ideas and the development of cutting-edge technology that meets contemporary challenges in the electronics sector.

Conclusion: Hsi-Feng Lin is an inventor whose work is at the forefront of heat dissipation technology. His patents reflect a deep understanding of thermal management challenges and offer innovative solutions that continue to drive advancements in electronic devices. As he progresses in his career, his contributions will undoubtedly play a crucial role in shaping the future of technology.

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