Company Filing History:
Years Active: 2022
Title: Innovations of Houjen Chu in Wafer Annealing Technology.
Introduction
Houjen Chu is a notable inventor based in Anhui, China. He has made significant contributions to the field of semiconductor technology, particularly through his innovative approaches to wafer processing.
Latest Patents
One of Houjen Chu's key patents is a wafer annealing method. This method involves preparing a wafer that includes multiple regions concentrically disposed on its surface. The process includes heating these regions through several stages, each with a different heating rate. The temperatures of the regions vary during each stage, followed by a heat preservation phase and cooling through nitrogen blowing. This innovative method enhances the electrical uniformity of the wafer, which is crucial for semiconductor performance.
Career Highlights
Houjen Chu is currently associated with Nexchip Semiconductor Co., Ltd., where he applies his expertise in semiconductor manufacturing. His work focuses on improving wafer processing techniques, which are essential for the production of high-quality semiconductor devices.
Collaborations
He collaborates with talented coworkers, including Yingya Shao and Binghui Bao, who contribute to the advancement of semiconductor technologies alongside him.
Conclusion
Houjen Chu's contributions to wafer annealing technology exemplify the importance of innovation in the semiconductor industry. His work not only enhances manufacturing processes but also supports the development of more efficient electronic devices.