Company Filing History:
Years Active: 1999-2000
Title: Horst F. Irmscher: Innovator in Heat Conductive Substrates
Introduction
Horst F. Irmscher is a notable inventor based in Corvallis, OR (US). He has made significant contributions to the field of electronics, particularly in the development of heat conductive substrates. With a total of 2 patents, his work has had a considerable impact on the efficiency of printed circuit boards.
Latest Patents
One of his latest patents involves a heat conductive substrate that is press-mounted within a through-opening of a printed circuit board. In this innovative design, an integrated circuit is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side. This configuration ensures that there is no direct thermal contact between the integrated circuit and the printed circuit board. The substrate is secured to the board by applying controlled pressure to various portions of the substrate, which reduces thickness and expands the area of the pressed portions, effectively locking the substrate in place. An air gap is created between the substrate and the printed circuit board, except for the pressed regions along the periphery of the substrate.
Career Highlights
Horst F. Irmscher is currently associated with Hewlett-Packard Company, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the thermal management of electronic devices, making them more efficient and reliable.
Collaborations
Throughout his career, Irmscher has collaborated with notable colleagues, including Paul A. Rubens and Charlie W. Gilson. These collaborations have contributed to the advancement of technology in the field of electronics.
Conclusion
Horst F. Irmscher's contributions to the field of heat conductive substrates have paved the way for advancements in electronic device efficiency. His innovative patents and collaborations highlight his role as a key figure in the industry.