Harbin, China

Hongfeng Li


Average Co-Inventor Count = 14.0

ph-index = 1


Company Filing History:

goldMedal2 out of 832,680 
Other
 patents

Years Active: 2021-2023

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2 patents (USPTO):Explore Patents

Title: **Innovator Spotlight: Hongfeng Li – Pioneering Heat Resistant Polyimide Films**

Introduction

Hongfeng Li, an accomplished inventor based in Harbin, China, has made significant contributions to the field of materials science through his innovative work on polyimide films. With a focus on high-temperature applications, Li's inventions address crucial challenges in the industry, particularly regarding the performance of adhesive materials under extreme conditions.

Latest Patents

Li holds two patents, the most notable of which involves a heat-resistant polyimide film. This invention presents a preparation method for the polyimide film that effectively resolves issues related to insufficient heat resistance in adhesive-bonded honeycomb structures and skin panels. By utilizing a specific polyimide solution, inorganic filler modifiers, and interface coupling agents, the process includes precise temperature and stirring conditions to create a resilient adhesive agent. Through subsequent filtering, degassing, casting, and annealing, the final high-temperature resistant polyimide film is produced, showcasing excellent performance in demanding environments.

Career Highlights

Throughout his career, Hongfeng Li has focused on advancing polymer technologies and their applications. His inventions are not only crucial in enhancing material performance but also play a critical role in improving the reliability of structures that rely on these materials in various engineering applications.

Collaborations

Li collaborates with fellow innovators Changwei Liu and Wanbao Xiao, combining their expertise to push the boundaries of material science further. Their teamwork serves to enhance the research and development process, ensuring that they remain at the forefront of innovation in the field of polyimide films.

Conclusion

With his groundbreaking patents and collaborative efforts, Hongfeng Li continues to make impactful contributions to the field of high-temperature resistant materials. His work not only provides solutions to current engineering challenges but also sets a foundation for future advancements in the use of polyimide films across various industries.

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