Company Filing History:
Years Active: 2019-2020
Title: Innovations of Hongbo Qi
Introduction
Hongbo Qi is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of modular assembly systems, holding a total of four patents. His work focuses on enhancing the functionality and efficiency of these systems through innovative methods and technologies.
Latest Patents
One of his latest patents is titled "Host applications of modular assembly system." This invention provides a method for delivering host instructions to a control module of a modular assembly system. It introduces a graphical programming environment that includes sets of first and second graphical representations for user interaction. Users can select graphical representations and input values for parameters and properties, leading to the generation of host instructions that control the operation of assembly modules.
Another significant patent is "Firmware of modular assembly system." This invention outlines a method for updating firmware on a control module. It involves obtaining noise-related information from the control module, calculating an encryption key, and receiving encrypted firmware from a host. The process ensures that the firmware can be securely decrypted and loaded into the control module, enhancing the system's reliability and performance.
Career Highlights
Hongbo Qi has worked with several companies, including Shenzhen Bell Creative Science and Education Co., Ltd. and Bell Holdings (Shenzhen) Technology Co., Ltd. His experience in these organizations has contributed to his expertise in modular assembly systems and firmware development.
Collaborations
Some of his notable coworkers include Zuobing Wang and Jinfu Zhou. Their collaboration has likely played a role in advancing the projects and innovations within their respective fields.
Conclusion
Hongbo Qi's contributions to modular assembly systems through his patents demonstrate his innovative spirit and technical expertise. His work continues to influence the development of efficient and reliable assembly technologies.