Company Filing History:
Years Active: 2009-2010
Title: Innovations of Hongbin Wu in Connector Technology
Introduction
Hongbin Wu is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of connector technology, holding 2 patents that showcase his innovative approach to electrical connectors.
Latest Patents
One of his latest patents is for a connector interface. This invention provides a connector interface comprising a connector socket interface and a connector plug interface. The connector socket interface includes a metal shell, insulator, band-shaped recess, and metal contacts. The connector plug interface also comprises a metal shell, insulator, and band-shaped protrusion. This design allows for coupling between the two interfaces, reducing the footprint of the coupling part and increasing the pin density of the contacts.
Another notable patent is for a high-density electrical connector. This invention features a plug body and a plastic enclosure that secures the plug body and connects it to a cable. The plug body consists of a shielding shell, an insulator, and a set of contacts. The design reduces the interface footprint of the plug and socket while increasing pin density, leading to a significant reduction in the volume of the corresponding device.
Career Highlights
Hongbin Wu is currently employed at Huawei Technologies Co., Limited, where he continues to innovate in the field of connector technology. His work has contributed to advancements in miniaturization and high-density designs in electronic devices.
Collaborations
He collaborates with talented coworkers, including Dong Yang and Wei Fang, who contribute to the innovative environment at Huawei.
Conclusion
Hongbin Wu's contributions to connector technology through his patents demonstrate his commitment to innovation and excellence in the field. His work not only enhances the functionality of connectors but also paves the way for more compact and efficient electronic devices.