Company Filing History:
Years Active: 2024
Title: Innovations of Hong Yang Ping
Introduction
Hong Yang Ping is a notable inventor based in Kunshan, China. He has made significant contributions to the field of connector technology, holding two patents that showcase his innovative spirit and technical expertise. His work primarily focuses on enhancing the functionality and compatibility of connectors used in various applications.
Latest Patents
Hong Yang Ping's latest patents include a "Connector for fitting with a docking connector comprising an electrical module plug and additional module plugs." This invention relates to a connector designed to accommodate a docking connector, featuring a housing with a first receiving portion and a second receiving portion. The connector is engineered to be compatible with both standard and additional applications, enhancing its versatility.
Another significant patent is for a "Conductive housing for connector and connector comprising the same." This invention involves a conductive housing that includes multiple side surfaces with terminal connection portions. The design incorporates conductive elastic pieces that enhance electromagnetic compatibility by covering gaps between terminal pins, thereby improving the overall performance of the connector.
Career Highlights
Hong Yang Ping is currently employed at Starconn Electronic (Su Zhou) Co., Ltd., where he continues to innovate and develop advanced connector solutions. His work at Starconn has positioned him as a key player in the electronics industry, contributing to the company's reputation for quality and innovation.
Collaborations
Hong has collaborated with talented coworkers, including Chung Nan Pao and Fu Su, who have contributed to his projects and innovations. Their teamwork has fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Hong Yang Ping's contributions to connector technology through his patents reflect his dedication to innovation and excellence. His work not only enhances the functionality of connectors but also sets a standard for future developments in the field.