Hong-Wei Bai

Title: Innovations of Hong-Wei Bai

Introduction

Hong-Wei Bai is a notable inventor based in Chengdu, China. He has made significant contributions to the field of electrical engineering, particularly with his innovative designs in electrical connection devices. His work is recognized for its practicality and efficiency in electronic applications.

Latest Patents

Hong-Wei Bai holds a patent for an electrical connection device. This device features an electrical connector and a sealing member. The connector includes an insulating housing with an abutting face. The sealing member is designed to be positioned between the face and a panel of an electronic device. It consists of an annular body, two first annular ribs, a plurality of second annular ribs, and several positioning posts. The annular body has first and second surfaces with multiple penetrating holes. The first annular ribs protrude from both surfaces, designed to abut the panel and the face. The second annular ribs encircle the penetrating holes and also abut the panel and the face.

Career Highlights

Hong-Wei Bai is currently employed at Molex Corporation, where he continues to develop innovative solutions in electrical connectivity. His work has contributed to advancements in the efficiency and reliability of electronic devices.

Collaborations

He has collaborated with notable colleagues such as Cun-Dong Zhang and Paul Christopher Berg, enhancing the scope and impact of his inventions.

Conclusion

Hong-Wei Bai's contributions to electrical engineering through his innovative patents demonstrate his commitment to advancing technology in electronic devices. His work continues to influence the industry positively.