Cupertino, CA, United States of America

Hong Sub Kim


 

Average Co-Inventor Count = 10.9

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2018

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2 patents (USPTO):Explore Patents

Title: Innovations of Hong Sub Kim

Introduction

Hong Sub Kim is an accomplished inventor based in Cupertino, CA. He holds 2 patents that showcase his expertise in the field of organopolysiloxane compositions. His work has significantly contributed to advancements in transducer technology.

Latest Patents

One of his latest patents is a curable organopolysiloxane composition for transducers. This invention provides a composition capable of producing a cured article that can be utilized as a transducer, offering excellent mechanical and electrical characteristics. Additionally, it includes dielectric inorganic fine particles with a specific dielectric constant of greater than or equal to 10, along with fine particles having a specific dielectric constant of less than 10. Another notable patent is also focused on a curable organopolysiloxane composition for transducer applications, emphasizing the inclusion of a compound with a highly dielectric functional group.

Career Highlights

Throughout his career, Hong Sub Kim has worked with prominent companies such as Dow Corning Corporation and Dow Corning Toray Company, Ltd. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the field of materials science.

Collaborations

He has collaborated with notable individuals in the industry, including Haruhiko Furukawa and Peter Cheshire Hupfield. These collaborations have further enriched his work and expanded his impact on the field.

Conclusion

Hong Sub Kim's contributions to the field of organopolysiloxane compositions and transducer technology highlight his innovative spirit and dedication to advancing material science. His patents reflect a commitment to excellence and a drive to create solutions that enhance technological capabilities.

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