Location History:
- Hwaseong-si, KR (2020)
- Suwon-si, KR (2023)
Company Filing History:
Years Active: 2020-2023
Title: Innovations by Hoe Chul Kim: Transforming Wafer Bonding Technology
Introduction: Hoe Chul Kim, an accomplished inventor based in Hwaseong-si, South Korea, has made significant contributions to the field of semiconductor manufacturing. With a total of two patents to his name, his innovative designs focus on enhancing the efficiency and reliability of wafer bonding apparatuses.
Latest Patents: Hoe Chul Kim's latest patents include a groundbreaking wafer bonding apparatus and an advanced substrate bonding apparatus. The wafer bonding apparatus comprises a lower support plate that structurally supports a first wafer while an upper support plate does the same for a second wafer. This innovative design features a movable lower structure that allows for precise vertical alignment during the bonding process.
Additionally, his substrate bonding apparatus includes a lower chuck and an upper chuck, where an electric actuator and a pressure sensor work together to ensure optimal pressure application during bonding. The system is designed for real-time monitoring and control, significantly enhancing the substrate bonding efficiency in semiconductor devices.
Career Highlights: Hoe Chul Kim works at Samsung Electronics Co., Ltd., one of the leading technology companies in the world. His career in this esteemed organization highlights his commitment to advancing semiconductor technology. Through his efforts, he has played a vital role in enhancing manufacturing processes and product quality in the industry.
Collaborations: Working alongside talented individuals such as Tae Yeong Kim and Dong Eog Kim, Hoe Chul Kim has fostered a collaborative environment that encourages innovation and creativity. These partnerships have allowed for the sharing of ideas and expertise, contributing to the successful development of his patented technologies.
Conclusion: Hoe Chul Kim stands out as a prominent figure in the field of wafer bonding technology, with his innovative approaches paving the way for advancements in semiconductor manufacturing. His patents not only reflect his technical expertise but also his dedication to pushing the boundaries of what is possible in the industry. As technology continues to evolve, inventions like those of Hoe Chul Kim remain crucial to driving progress in semiconductor applications.