Ho Yueh-Feng

Title: Ho Yueh-Feng: Innovator in Integrated Structures

Introduction: Ho Yueh-Feng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated structures, particularly with his innovative patent that enhances the functionality of silicon-through vias. His work is recognized for its potential applications in advanced electronic devices.

Latest Patents: Ho Yueh-Feng holds a patent for an "Integrated structure with a silicon-through via." This invention includes a substrate, a through-silicon via penetrating the substrate, a conductive protective structure surrounding the through-silicon via, and a first and a second conductive dummy patterns with different shapes disposed between the through-silicon via and the conductive protective structure. This patent showcases his expertise in semiconductor technology and integrated circuit design. He has 1 patent to his name.

Career Highlights: Ho Yueh-Feng is currently associated with Ipenval Consultant Inc., where he continues to push the boundaries of innovation in his field. His work has been instrumental in developing new technologies that improve the efficiency and performance of electronic components.

Collaborations: Throughout his career, Ho has collaborated with talented individuals such as Huang Chao-Yuan and Yang Ming-Sheng. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion: Ho Yueh-Feng is a distinguished inventor whose contributions to integrated structures are paving the way for future innovations in electronics. His patent work and collaborations reflect his commitment to advancing technology in meaningful ways.