Niigata-ken, Japan

Hisashi Ohshima


Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2000-2001

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2 patents (USPTO):Explore Patents

Title: Hisashi Ohshima: Innovator in Silicon Semiconductor Fabrication

Introduction

Hisashi Ohshima is a notable inventor based in Niigata-ken, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of silicon semiconductor discrete wafers. With a total of two patents to his name, Ohshima's work emphasizes precision and productivity in semiconductor manufacturing.

Latest Patents

Ohshima's latest patents focus on methods for fabricating silicon semiconductor discrete wafers. One patent describes a method that ensures excellent finishing accuracy and productivity while dressing the grinding wheel. This process involves mixing air and grinding water from a surface grinding process and jetting the mixture back onto the grinding wheel during wafer grinding. The final processing includes wet-etching the processing surface. Another patent outlines a method for fabricating a discrete wafer with a double-layer structure, which includes an impurity diffused layer and an impurity non-diffused layer. This method also involves cutting the wafer and grinding the surfaces to a predetermined thickness, followed by wet-etching as the final step.

Career Highlights

Ohshima is currently employed at Naoetsu Electronics Co., Ltd., where he continues to innovate in the semiconductor field. His work has contributed to advancements in manufacturing techniques that enhance the quality and efficiency of semiconductor products.

Collaborations

Ohshima collaborates with Tsutomu Satoh, a fellow professional in the semiconductor industry. Their partnership has likely fostered innovative ideas and improvements in their respective projects.

Conclusion

Hisashi Ohshima's contributions to semiconductor technology through his patents and work at Naoetsu Electronics Co., Ltd. highlight his role as a key innovator in the field. His methods for fabricating silicon semiconductor discrete wafers demonstrate a commitment to enhancing manufacturing processes and product quality.

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