Tokyo, Japan

Hisashi Matsumo


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by Hisashi Matsumo: Pioneering Black Conductive Compositions

Introduction

Hisashi Matsumo is an esteemed inventor located in Tokyo, Japan. He has made significant contributions to the field of conductive materials through his innovative patent. As a dedicated professional at DuPont de Nemours and Company, Matsumo continues to advance technology and materials science, particularly in the development of conductive film compositions.

Latest Patents

Matsumo holds a patent for "Black conductive thick film compositions, black electrodes, and methods of forming thereof." This invention is directed towards the creation of black conductive compositions and the formulation of black electrodes derived from such compositions. Notably, the invention focuses on a single-layer bus electrode, which has notable applications in various electronic devices and components.

Career Highlights

Hisashi Matsumo has cultivated a remarkable career at DuPont de Nemours and Company, where he harnesses his expertise in materials science. His dedication to innovation is reflected in his patent and underscores his role in developing cutting-edge technology that meets industry demands.

Collaborations

Throughout his career, Matsumo has collaborated with talented colleagues, including Ji-Yeon Lee and Michael F. Barker. Working alongside these esteemed professionals, Matsumo has furthered his research and inventions, contributing to advancements within their field and the company.

Conclusion

Hisashi Matsumo's work exemplifies the spirit of innovation in materials science. His patent on black conductive thick film compositions reveals his commitment to developing essential technologies. With ongoing contributions at DuPont de Nemours and Company and collaborative efforts with fellow inventors, Matsumo continues to pave the way for future innovations in electronic materials.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…