Hisahiro Ikeda

Title: Hisahiro Ikeda: Innovator in Reflow Soldering Technology

Introduction

Hisahiro Ikeda is a notable inventor based in Kariya, Japan. He has made significant contributions to the field of manufacturing technology, particularly in the area of reflow soldering. His innovative approach has led to the development of a unique reflow device that enhances the efficiency of substrate manufacturing.

Latest Patents

Hisahiro Ikeda holds a patent for a "Reflow device and method for manufacturing substrate using the reflow device." This invention is designed to perform reflow soldering on substrates that contain components with varying heat capacities. The reflow device features multiple heating sections that apply gas to the substrate, a booth to accommodate these heating sections, and a controller that manages the heating process. This controller is capable of executing a heating control sequence that increases the temperatures of both components before reducing the temperature of the first component while continuing to heat the second component.

Career Highlights

Ikeda is currently employed at Denso Corporation, a leading global automotive supplier. His work at Denso has allowed him to focus on advancing manufacturing processes and improving product quality through innovative technologies. His dedication to research and development has positioned him as a key player in the industry.

Collaborations

Throughout his career, Ikeda has collaborated with several talented individuals, including Masayasu Yamamoto and Atsushi Furumoto. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Hisahiro Ikeda's contributions to reflow soldering technology exemplify the impact of innovation in manufacturing. His patent and work at Denso Corporation highlight his commitment to advancing the field and improving production methods.