Hiroyuki Miura

Title: Hiroyuki Miura: Innovator in Electronic Component Packaging

Introduction

Hiroyuki Miura is a notable inventor based in Helsinki, Finland. He has made significant contributions to the field of electronic component packaging, particularly through his innovative patent.

Latest Patents

Hiroyuki Miura holds a patent for a lid body, electronic component accommodation package, and electronic device. This patent describes a lid body that includes a base made from an alloy of iron and nickel. It features a first film on the lower surface of the base containing nickel, and a second film beneath the first film that contains copper. The design reduces the penetration of crystal grain boundaries of the base by copper during welding, thereby minimizing the occurrence of cracks and enhancing the airtightness of the package.

Career Highlights

Hiroyuki Miura is associated with Kyocera Corporation, where he has been instrumental in developing advanced packaging solutions for electronic components. His work has contributed to the reliability and efficiency of electronic devices.

Collaborations

Hiroyuki has collaborated with talented coworkers such as Takayuki Kimura and Hisaki Masuda, further enhancing the innovative environment at Kyocera Corporation.

Conclusion

Hiroyuki Miura's contributions to electronic component packaging through his innovative patent demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the design and functionality of electronic devices.