Hiroyuki Iwata

Title: Hiroyuki Iwata: Innovator in Adhesive Technology

Introduction

Hiroyuki Iwata is a prominent inventor based in Ibaraki, Japan. He is known for his contributions to adhesive technology, particularly in the field of flexible printed circuit boards. His innovative work has led to the development of a unique coverlay film that enhances the performance of electronic components.

Latest Patents

Hiroyuki Iwata holds a patent for an "Adhesive composition and coverlay film therewith." This invention provides a coverlay film that offers improved adhesiveness, heat resistance against molten solder alloy, and enhanced punching workability. The coverlay film is characterized by a novel formulation of adhesive that forms a layer on a substrate plastic, such as polyimide film. The adhesive is composed of an epoxy resin, carboxylated nitrile rubber, a curing agent, a curing accelerator, and fine inorganic powder, each specified in type and weight proportion. He has 1 patent to his name.

Career Highlights

Hiroyuki Iwata has made significant strides in his career at Shin-Etsu Chemical Co., Ltd. His work has been instrumental in advancing adhesive technologies that are critical for the electronics industry. His innovative approach has positioned him as a key figure in the development of materials that enhance the reliability and performance of electronic devices.

Collaborations

Hiroyuki Iwata has collaborated with notable colleagues, including Mitoshi Sakaguchi and Makoto Fujiwara. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Hiroyuki Iwata's contributions to adhesive technology have made a lasting impact on the electronics industry. His innovative patent for a coverlay film exemplifies his commitment to enhancing product performance and reliability.