Hiroshi Iimura

Title: Hiroshi Iimura: Innovator in Electronic Component Packaging

Introduction

Hiroshi Iimura is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of electronic component packaging, holding a total of four patents. His work focuses on improving the efficiency and reliability of electronic components, particularly in the context of printed circuit boards.

Latest Patents

Iimura's latest patents include innovations related to electronic component packages and methods for inspecting printed circuit boards. One of his key inventions is a ball grid array (BGA) electronic component package designed to enhance mounting efficiency while preventing the breaking away of footprints at circuit-connecting portions. This BGA package features reinforcing bumps located outward of the conventional circuit-connecting bumps. This design ensures that even if a shock is applied to the BGA package, particularly at its most sensitive outer portions, the shock is absorbed by the reinforcing bumps. Consequently, this prevents the footprints on both the BGA package and the printed circuit board from breaking away or cracking.

Career Highlights

Throughout his career, Hiroshi Iimura has worked with prominent companies such as Fujitsu Corporation and Fujitsu Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas in electronic component packaging.

Collaborations

Iimura has collaborated with notable colleagues, including Yasuhiro Ichihara and Yutaka Higashiguchi. Their teamwork has contributed to advancements in the field of electronic components.

Conclusion

Hiroshi Iimura's contributions to electronic component packaging demonstrate his commitment to innovation and improvement in technology. His patents reflect a deep understanding of the challenges faced in the industry and provide effective solutions to enhance the reliability of electronic components.