Osaka, Japan

Hiroshi Gouda

USPTO Granted Patents = 2 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020

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2 patents (USPTO):Explore Patents

Title: Hiroshi Gouda: Innovator in Saw Wire Technology

Introduction

Hiroshi Gouda is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of cutting apparatus technology, particularly through his innovative designs in saw wire.

Latest Patents

Hiroshi Gouda holds 2 patents that showcase his expertise. His latest patents include a saw wire and cutting apparatus that features a metal wire containing at least one of tungsten and a tungsten alloy. This saw wire is designed with a nickel plating layer over the metal wire, along with an adhesion layer that contains nickel and tungsten. Additionally, a plurality of abrasive particles is provided at the surface of the nickel plating layer. Another patent involves a saw wire that includes a rhenium-tungsten alloy, where the rhenium content is between 0.1 wt % and 10 wt % of the total weight. This wire boasts impressive mechanical properties, including an elastic modulus of at least 350 GPa and a tensile strength of at least 3500 MPa.

Career Highlights

Hiroshi Gouda is currently associated with Panasonic Intellectual Property Management Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of cutting tools used in various industries.

Collaborations

Hiroshi collaborates with talented individuals such as Tomohiro Kanazawa and Tetsuji Shibata, contributing to a dynamic team focused on innovation.

Conclusion

Hiroshi Gouda's contributions to saw wire technology exemplify his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of materials and their applications in cutting apparatus, making him a valuable asset in the field.

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