Company Filing History:
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1 out of 272 
Years Active: 2015
Title: Hiroko Asada: Innovator in Adhesive Technology
Introduction
Hiroko Asada is a prominent inventor based in Otsu, Japan. She has made significant contributions to the field of adhesive technology, particularly through her innovative resin compositions. Her work has led to advancements that are essential in various applications, including printed wiring boards.
Latest Patents
Hiroko Asada holds 1 patent for her invention titled "Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer." This patent describes a resin composition that includes a polyurethane resin with specific characteristics, a polyester resin, and epoxy resins. The composition is designed to optimize adhesive performance in various applications.
Career Highlights
Throughout her career, Hiroko has worked with notable companies such as Toyo Boseki and Nippon Mektron Limited. Her experience in these organizations has allowed her to refine her skills and contribute to significant projects in adhesive technology.
Collaborations
Hiroko has collaborated with talented individuals in her field, including Takeshi Ito and Shintaro Nanbara. These partnerships have fostered innovation and have been instrumental in her research and development efforts.
Conclusion
Hiroko Asada's contributions to adhesive technology through her innovative patents and collaborations highlight her role as a leading inventor in her field. Her work continues to influence advancements in adhesive applications, showcasing the importance of innovation in technology.